Overview
Product overview
Product application: tools / semiconductor parts / grinding stones for precision grinding / cemented carbide, cermet and ceramics
DPG (Diamond Pellet Grinding) wheels use a soft bond emphasizing cutting action and a hard bond emphasizing surface finish and wheel life, supporting continuous precision polishing.
Applications:
- Machining magnetic materials, semiconductor components and related workpieces
- For other precision-machining applications
- Abrasive grain: SD
- Grain size: #325~#3,000
- Grade: L, M, N, O, P, Q, R
Features
- TKX DPG grinding stone
Please provide the complete model, quantity, application and operating conditions so we can check the requirement against the product documentation.
Specifications & Models
Specifications
Models
| Model | Inquiry |
|---|---|
| DPG | Inquire |
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